ASM International forecasts stronger Q4 sales, targets 2030 revenue goal early
Rising investment in artificial intelligence chip capacity is lifting demand for ASM International's semiconductor equipment. The Dutch company says it now expects fourth-quarter revenue above market forecasts and plans to reach its 2030 sales target in 2027.
Highlights
- ASM International forecasts Q4 revenue of 1.23 billion euros, plus or minus 5%, exceeding the 1.18 billion euros LSEG analyst consensus.
- The company projects revenue above 5.7 billion euros in 2027, achieving its prior 2030 target three years early versus analysts’ 5.41 billion euros estimate.
- Third-quarter sales reached 1.16 billion euros, surpassing the 1.10 billion euros analyst forecast, driven by strong AI-fueled demand for advanced chip equipment.
Quarterly outlook and 2027 target
As reported by Reuters, ASM International expects fourth-quarter revenue of 1.23 billion euros, plus or minus 5%, above the 1.18 billion euros average analyst forecast in an LSEG poll.The company also says revenue will exceed 5.7 billion euros at constant currencies in 2027, reaching a sales target originally set for 2030 three years ahead of schedule. Analysts polled by LSEG expect 2027 revenue of 5.41 billion euros.
Third-quarter sales come in at 1.16 billion euros, compared with analysts' estimate of 1.10 billion euros. Michael Roeg, an analyst at Degroof Petercam, says the earnings are a "triple beat," supported by stronger-than-expected third-quarter revenue and both quarterly and annual outlooks.
AI demand drives chip equipment spending
Artificial intelligence remains the semiconductor industry's main growth driver, as chipmakers continue expanding capacity for advanced production. At the same time, elevated expectations mean investors are closely watching earnings for evidence that demand is matching the scale of current investment.ASM makes machines that deposit ultra-thin layers of material onto silicon wafers. The company holds a leading position in atomic layer deposition, a process used to build films one atomic layer at a time for the most advanced chip models.
In our earlier article on the AI-linked tech selloff and rate fears, we explained how hotter inflation data revived expectations for further Fed hikes and pressured Nasdaq-linked names tied to AI infrastructure spending. We also highlighted investor concerns that higher borrowing costs could make it harder to finance large-scale AI buildouts, adding volatility across chip and big-tech shares.