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Texas Instruments announced the launch of new isolated power modules at APEC 2026, featuring its IsoShield packaging technology.
These modules are designed to deliver industry-leading power density and can reduce overall power solution size by up to 70 percent, representing a significant advancement in power semiconductor technology. The company aims to address growing demands for compact and efficient power solutions across multiple sectors. More technical details are available through Texas Instruments’ official channels.
Texas Instruments has expanded its focus on power efficiency in recent years. The company previously partnered with Nvidia to develop advanced power solutions for AI data centers. That collaboration reduced the conversion process to two stages. The launch of the new isolated power modules continues its push for more compact and efficient technology.